SmartKem Inc. and Manz Asia Collaborate on Innovative AI Chip Packaging
MANCHESTER, England, July 9, 2025 -- SmartKem (Nasdaq: SMTK), a company aiming to revolutionize the electronics industry with a new class of transistor technology, has revealed a preliminary Joint Development Agreement (JDA) with Manz Asia. This agreement focuses on the co-development of next-generation dielectric ink solutions specifically designed for advanced packaging manufacturing, particularly in AI chip applications.
Building on Existing Collaboration
SmartKem's Chairman and CEO, Ian Jenks, stated, "This joint development agreement builds on our collaboration with Manz Asia, which has already resulted in our first demonstration at SEMICON® SEA 2025. Together, we intend to create scalable, high-performance solutions that address critical bottlenecks in advanced computer and AI chip packaging. By combining SmartKem's unique semiconductor materials with Manz's precision inkjet technology, we aim to establish new manufacturing paradigms that respond to the demand for 12" wafer-level packaging solutions and large-area panel packaging."
Advancements in Semiconductor Manufacturing
Manz Asia's General Manager, Robert Lin, added, "By integrating SmartKem's expertise in material science with our engineering excellence in semiconductor manufacturing equipment, this JDA will accelerate the adoption of dielectric ink technology, enhancing scalability, resolution, and reliability for future chip integration. Our dielectric inks are crucial for back-end-of-line processes, especially in top metal layer insulation and redistribution layer (RDL) patterning for advanced packaging."
As the demand for AI computing surges, improvements in 12" wafer-level packaging and large-area panel packaging present transformative opportunities for data center infrastructure. This approach not only enhances chip density and interconnect speeds but also promotes sustainable manufacturing processes.
About SmartKem and Manz Asia
SmartKem is dedicated to innovating electronics through its proprietary TRUFLEX® semiconductor polymers, which facilitate low-temperature printing processes compatible with existing manufacturing infrastructure. The company is working on commercial-scale production and Electronic Design Automation (EDA) tools to demonstrate the viability of its materials in various applications, including AI chip packaging.
Manz Asia specializes in advanced semiconductor equipment, providing comprehensive solutions from lab-scale to mass production, and is committed to enhancing production efficiency and optimizing process quality in the semiconductor industry.
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